Spectrum

SPECIAL FEATURES

  • Laser Diode Source with GREEN Laser.
  • Low Maintenances sealed, Long life pump diodes.
  • Computer controlled all the laser commands with the help of software.

BANDING FEATURES

  • R.F. attenuation system with constant/stable Amp(I) to maintain diod life.
  • Auto Image and parameters capture.
  • "AUTO DEPTH"- Two Side sawing - Two Side sawing.
  • Next to "NIL" breakage ratio.
  • Smooth cutting surface.
  • 40-50% less weight loss than any IR Laser.
  • Eliminates diamond breakage & damage to a great extent by reducing
  • unwanted internal reflections and internal focusing.

Technical Specifications

LASER

Wavelength

532 nm

Output Power @ 10 KHz, (Watts)

20 W

Transverse Mode

TEMoo

Beam Diameter, (mm)

0.9

Beam Quality(M2)

<1.2

Pulse Repetition Frequency (PRF), KHz

1-20

Pulsewidth @ 15 KHz, ns

70

Pulse Stability @ 10 KHz (RMS)

3

Polarization

Linear(VER)

Output Stability, (% Over 8 hrs)

1

Working Temp(c)

16

CNC SYSTEM

Axis Travel

130mm*130mm*70mm

Resolution

1 Micron or better

Accuracy

2 Micron/25mm

Repeatability

2 Micron/25 mm bi directional

Drive

Servo Drive with Encoder.

MECHANICAL

Dimensions

1250 mm* 600 mm* 1450 mm

ELECTRICAL REQUIREMENT

AC 208-230 V, 60 Hz, 10 AMPS.

AC 200 V, 50 Hz, 10 Amps.

CHILLER

No Requirement of External Chiller.